HS200-TP2

Ohmite HS200-TP2

Part No:

HS200-TP2

Manufacturer:

Ohmite

Datasheet:

-

Package:

-

AINNX NO:

51797015-HS200-TP2

Description:

Thermal Interface Pad, Silicone, 3W/m·K, 89.7x72.5mm 0.5mm

Products specifications
  • Material
    Silicone
  • Shape
    Rectangular
  • Dimensions
    89.7x72.5mm
  • Factory Pack QuantityFactory Pack Quantity
    25
  • Manufacturer
    Ohmite
  • Brand
    Ohmite
  • RoHS
    Details
  • Package
    Bulk
  • Mfr
    Ohmite
  • Product Status
    Active
  • Series
    HS-TP2
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Type
    Interface Pad, Sheet
  • Color
    Blue
  • Subcategory
    Thermal Management
  • Usage
    IGBT - Heat Transfer Low Thermal Resistance
  • Shelf Life
    -
  • Adhesive
    Tacky - Both Sides
  • Storage/Refrigeration Temperature
    -
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Thermal Interface Products
  • Shelf Life Start
    -
  • Backing, Carrier
    -
  • Outline
    89.70mm x 72.50mm
  • Thermal Conductivity

    a measure of a material's ability to?conduct heat.?

    3W/m·K
  • Thermal Resistivity

    Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

    -
  • Product Category

    a particular group of related products.

    Thermal Interface Products
  • Width
    72.5mm
  • Length
    89.7mm
  • Diameter
    5.1mm
  • Thickness
    0.5mm
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