NXP USA Inc. BZV55-C5V1

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Terminals

2

Package Description

O-LELF-R2

Package Style

LONG FORM

Moisture Sensitivity Levels

1

Package Body Material

GLASS

Operating Temperature-Min

-65 °C

Reflow Temperature-Max (s)

40

Reference Voltage-Nom

5.1 V

Operating Temperature-Max

200 °C

Rohs Code

Yes

Manufacturer Part Number

BZV55-C5V1

Power Dissipation (Max)

0.4 W

Package Shape

ROUND

Manufacturer

NXP Semiconductors

Number of Elements

1

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

3.21

JESD-609 Code

e3

Pbfree Code

Yes

Terminal Finish

Tin (Sn)

Subcategory

Voltage Reference Diodes

Technology

ZENER

Terminal Position

END

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WRAP AROUND

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

2

JESD-30 Code

O-LELF-R2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

UNIDIRECTIONAL

Configuration

SINGLE

Diode Type

ZENER DIODE

Case Connection

ISOLATED

Voltage Tol-Max

5%

Working Test Current

5 mA

Reverse Current-Max

2 µA

Dynamic Impedance-Max

60 Ω