NXP USA Inc. BZX84-C18

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Terminals

3

Package Description

ROHS COMPLIANT, PLASTIC PACKAGE-3

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-65 °C

Reflow Temperature-Max (s)

30

Reference Voltage-Nom

18 V

Operating Temperature-Max

150 °C

Rohs Code

Yes

Manufacturer Part Number

BZX84-C18

Power Dissipation (Max)

0.25 W

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Number of Elements

1

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

3.16

Part Package Code

SOT-23

JESD-609 Code

e3

Pbfree Code

Yes

Terminal Finish

Tin (Sn)

Subcategory

Voltage Reference Diodes

Technology

ZENER

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PDSO-G3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

UNIDIRECTIONAL

Configuration

SINGLE

Diode Type

ZENER DIODE

Voltage Tol-Max

5%

JEDEC-95 Code

TO-236AB

Working Test Current

5 mA

Dynamic Impedance-Max

45 Ω