NXP Semiconductors / Freescale PCF1252-1TD-T

Package / Case

SOIC

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

8

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Number of Terminations

8

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Supply Voltage

2.4V

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

8

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

6V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

2.4V

Number of Channels

1

Analog IC - Other Type

POWER SUPPLY SUPPORT CIRCUIT

Adjustable Threshold

NO

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free