MAX6326-29D,115

Freescale Semiconductor, Inc. (NXP Semiconductors) MAX6326-29D,115

Part No:

MAX6326-29D,115

Datasheet:

-

Package:

-

AINNX NO:

32007342-MAX6326-29D,115

Description:

Products specifications
  • EU RoHS
    Supplier Unconfirmed
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Number of Supervisors
    1
  • Maximum Reset Active Time (ms)
    185(Typ)
  • Output Driver
    Active Low/Push-Pull
  • Minimum Reset Threshold Voltage (V)
    2.8565
  • Typical Reset Threshold Voltage (V)
    2.9
  • Maximum Reset Threshold Voltage (V)
    2.9435
  • Monitored Voltage (V)
    2.5|3|3.3|5
  • Minimum Operating Supply Voltage (V)
    1.2
  • Maximum Operating Supply Voltage (V)
    5.5
  • Maximum Supply Current (uA)
    1(Typ)
  • Maximum Power Dissipation (mW)
    320
  • Power Fail Detection
    No
  • Watchdog Timers
    No
  • Manual Reset
    No
  • Chip Enable Signals
    No
  • Battery Backup Switching
    No
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    1.2(Max)
  • Package Width
    1.7(Max)
  • Package Length
    3(Max)
  • PCB changed
    3
  • Standard Package Name
    SOT-23
  • Supplier Package
    TO-236AB
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    Power Supply Monitor
  • Pin Count

    a count of all of the component leads (or pins)

    3
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