SPC5676RDK3MVU1

NXP Semiconductors SPC5676RDK3MVU1

Part No:

SPC5676RDK3MVU1

Manufacturer:

NXP Semiconductors

Package:

-

AINNX NO:

69823508-SPC5676RDK3MVU1

Description:

NXP 32-bit MCU, Power Arch core, 6MB Flash, 184MHz, -40/+125degC, Automotive Grade, PBGA 416

Products specifications
  • Number of Pins
    416
  • Memory Types
    FLASH
  • RoHS
    Compliant
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125 °C
  • Min Operating Temperature
    -40 °C
  • Frequency
    180 MHz
  • Interface
    CAN, EBI/EMI, SCI, SPI
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    6 MB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    384 kB
  • Peripherals
    DMA, POR, PWM
  • Data Bus Width
    32 b
  • Halogen Free
    Halogen Free
  • Number of Timers/Counters
    3
  • Max Frequency
    184 MHz
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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