NXP Semiconductors MKL27Z256VFM4

Number of Pins

32

Case/Package

QFN

Memory Types

FLASH

Number of I/Os

23

RoHS

Compliant

Schedule B

8542310000

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

105 °C

Min Operating Temperature

-40 °C

Frequency

48 MHz

Interface

I2C, SPI, UART, USART, USB

Max Supply Voltage

In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

3.6 V

Min Supply Voltage

The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

1.71 V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256 kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

32 kB

Peripherals

DMA, LVD, POR, PWM, WDT

Core Architecture

ARM

REACH SVHC

No SVHC