NXP Semiconductors PHKD3NQ10T

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

Transistor Element Material

SILICON

Exterior Housing Material

2

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Drain Current-Max (ID)

3 A

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

JESD-609 Code

e4

Pbfree Code

Yes

ECCN Code

EAR99

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PDSO-G8

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

Drain-source On Resistance-Max

0.09 Ω

Pulsed Drain Current-Max (IDM)

12 A

DS Breakdown Voltage-Min

100 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

2 W

Saturation Current

2