NXP Semiconductors MCIMX6S5DVM10AC

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Copper, Silver, Tin

Number of Pins

624

Weight

1.25251 g

Case/Package

MAPBGA

Memory Types

L2 Cache, ROM, SRAM

RoHS

Compliant

Schedule B

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

95 °C

Min Operating Temperature

0 °C

Frequency

1 GHz

Interface

CAN, Ethernet, I2C, I2S, PCIe, SPI, UART, USB

Max Supply Voltage

In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

1.5 V

Min Supply Voltage

The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

1.35 V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

96 kB

RAM Size

128 kB

Data Bus Width

32 b

Core Architecture

ARM

Max Frequency

1 GHz

Number of Cores

1

REACH SVHC

No SVHC