NXP Semiconductors MCIMX537CVP8C2

Factory Lead Time

15 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

529

Rohs Code

Yes

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

TEPBGA-529

Clock Frequency-Max

27 MHz

Moisture Sensitivity Levels

3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA529,23X23,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Max

1.15 V

Supply Voltage-Min

1.05 V

Supply Voltage-Nom

1.1 V

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

S-PBGA-B529

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

Speed

800 MHz

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Supply Current-Max

800 mA

Bit Size

32

Seated Height-Max

1.85 mm

Address Bus Width

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

26

Boundary Scan

YES

Low Power Mode

YES

External Data Bus Width

32

Format

FLOATING POINT

Integrated Cache

YES

RAM (words)

147456

Number of Serial I/Os

52

On Chip Data RAM Width

8

Number of DMA Channels

32

Length

19 mm

Width

19 mm