MC9S08QG8CDTER

NXP Semiconductors MC9S08QG8CDTER

Part No:

MC9S08QG8CDTER

Manufacturer:

NXP Semiconductors

Package:

-

AINNX NO:

69816149-MC9S08QG8CDTER

Description:

MCU 8-bit S08 S08 CISC 8KB Flash 2.5V/3.3V Automotive 16-Pin TSSOP T/R

Products specifications
  • Mount
    Surface Mount
  • Number of Pins
    16
  • Case/Package
    TSSOP
  • Memory Types
    FLASH
  • Number of I/Os
    12
  • RoHS
    Compliant
  • Schedule B
    8542310000, 8542310000|8542310000|8542310000|8542310000|8542310000
  • Watchdog Timers
    Yes
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape
  • Termination
    SMD/SMT
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • Frequency
    20 MHz
  • Interface
    I2C, SCI, SPI
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.8 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    8 kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    512 B
  • Number of Bits
    8
  • Peripherals
    I2C, LVD, POR, PWM, WDT
  • Access Time
    10 µs
  • Data Bus Width
    8 b
  • Halogen Free
    Halogen Free
  • Number of Timers/Counters
    1
  • Density
    64 kb
  • Max Frequency
    20 MHz
  • Number of Programmable I/O
    12
  • Number of PWM Channels
    2
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    No SVHC
  • Lead Free
    Lead Free
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