NXP Semiconductors BZV55-C3V6,115

Mounting Type

Surface Mount

Package / Case

DO-213AC, MINI-MELF, SOD-80

Supplier Device Package

LLDS; MiniMelf

Mfr

NXP Semiconductors

Impedance (Max) (Zzt)

90 Ohms

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-65°C ~ 200°C

Tolerance

±5%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Current - Reverse Leakage @ Vr

5 µA @ 1 V

Voltage - Forward (Vf) (Max) @ If

900 mV @ 10 mA

Power - Max

500 mW

Voltage - Zener (Nom) (Vz)

3.6 V