NXP Semiconductors PESD3V3S1UL

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Terminals

2

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

DFN

Package Description

R-PBCC-N2

Breakdown Voltage-Nom

5.6 V

Moisture Sensitivity Levels

1

Number of Elements

1

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

CHIP CARRIER

JESD-609 Code

e3

Pbfree Code

Yes

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW LEAKAGE CURRENT

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.10.00.50

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

2

JESD-30 Code

R-PBCC-N2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

UNIDIRECTIONAL

Configuration

SINGLE

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE

Rep Pk Reverse Voltage-Max

3.3 V

Non-rep Peak Rev Power Dis-Max

150 W

Breakdown Voltage-Min

5.2 V

Breakdown Voltage-Max

6 V