NXP Semiconductors 74LVC16373ADGG,518

ECCN (US)

EAR99

Number of Channels per Chip

16

Latch Mode

Transparent

Logic Family

LVC

Minimum Operating Supply Voltage (V)

1.2

Maximum High Level Output Current (mA)

-24

Maximum Low Level Output Current (mA)

24

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

14.4

Maximum Propagation Delay Time @ Maximum CL (ns)

2.4(Typ)@3.3V|2.9(Typ)@2.7V

Set/Reset

No

Bus Hold

No

Number of Output Enables per Element

1

Number of Outputs per Chip

16

Number of Selection Inputs per Element

0

Number of Input Enables per Element

1

Number of Inputs per Chip

16

Number of Elements per Chip

2

Package Width

6.2(Max)

Package Length

12.6(Max)

Package Height

1.05(Max)

Mounting

Surface Mount

Supplier Package

TSSOP

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

Propagation Delay Test Condition (pF)

50

Maximum Quiescent Current (uA)

80

Typical Quiescent Current (uA)

0.1

Tolerant I/Os (V)

5

Maximum Operating Supply Voltage (V)

3.6

Typical Operating Supply Voltage (V)

1.8|2.5|3.3

PCB changed

48

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

D-Type

Pin Count

a count of all of the component leads (or pins)

48

Output Type

3-State

Polarity

Non-Inverting

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant