NXP Semiconductors 74ALVCH16373DGG,118

Package Length

12.6(Max)

ECCN (US)

EAR99

Logic Family

ALVC

Latch Mode

Transparent

Number of Channels per Chip

16

Number of Elements per Chip

2

Number of Inputs per Chip

16

Number of Input Enables per Element

1

Number of Selection Inputs per Element

0

Number of Outputs per Chip

16

Number of Output Enables per Element

1

Bus Hold

Yes

Set/Reset

No

Maximum Propagation Delay Time @ Maximum CL (ns)

2.1(Typ)@3.3V|2.3(Typ)@2.7V

Absolute Propagation Delay Time (ns)

7.3

Process Technology

CMOS

Package Width

6.2(Max)

PCB changed

48

Maximum Low Level Output Current (mA)

24

Maximum High Level Output Current (mA)

-24

Minimum Operating Supply Voltage (V)

1.2

Typical Operating Supply Voltage (V)

2.5|1.8|3.3

Maximum Operating Supply Voltage (V)

3.6

Typical Quiescent Current (uA)

0.2

Maximum Quiescent Current (uA)

40

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Package

TSSOP

Mounting

Surface Mount

Package Height

1.05(Max)

Package

Bulk

Base Product Number

74ALVCH16373

Mfr

NXP USA Inc.

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Type

D-Type

Pin Count

a count of all of the component leads (or pins)

48

Output Type

3-State

Polarity

Non-Inverting

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant