NXP Semiconductors 74ALVCH16373DGG,118

ECCN (US)

EAR99

Logic Family

ALVC

Latch Mode

Transparent

Number of Channels per Chip

16

Number of Elements per Chip

2

Number of Inputs per Chip

16

Number of Input Enables per Element

1

Number of Selection Inputs per Element

0

Number of Outputs per Chip

16

Number of Output Enables per Element

1

Bus Hold

Yes

Set/Reset

No

Maximum Propagation Delay Time @ Maximum CL (ns)

2.1(Typ)@3.3V|2.3(Typ)@2.7V

Absolute Propagation Delay Time (ns)

7.3

Process Technology

CMOS

Maximum Low Level Output Current (mA)

24

Maximum High Level Output Current (mA)

-24

Minimum Operating Supply Voltage (V)

1.2

Typical Operating Supply Voltage (V)

2.5|1.8|3.3

Maximum Operating Supply Voltage (V)

3.6

Typical Quiescent Current (uA)

0.2

Maximum Quiescent Current (uA)

40

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Package

TSSOP

Mounting

Surface Mount

Package Height

1.05(Max)

Package Length

12.6(Max)

Package Width

6.2(Max)

PCB changed

48

Package

Bulk

Base Product Number

74ALVCH16373

Mfr

NXP USA Inc.

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Type

D-Type

Pin Count

a count of all of the component leads (or pins)

48

Output Type

3-State

Polarity

Non-Inverting

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant