NXP PIP3117-B，118

Lifecycle Status

Obsolete (Last Updated: 2 weeks ago)

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Number of Pins

3

Weight

749.986634 mg

Voltage, Rating

13 V

Voltage Rating (DC)

13 V

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Tolerance

5 %

Number of Terminations

2

Termination

Axial

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

-80 ppm/°C

Resistance

5.6 Ω

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

200 °C

Min Operating Temperature

-40 °C

Composition

Wirewound

Power Rating

3 W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

3 W

Military Standard

Not

Features

Flame Retardant Coating

Width

4.8 mm

Length

13 mm

Diameter

4.8 mm

Thickness

4.8 mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No