04-TLS19

NTE Electronics, Inc. 04-TLS19

Part No:

04-TLS19

Datasheet:

-

Package:

-

AINNX NO:

31809050-04-TLS19

Description:

Products specifications
  • Material
    Polyamide (PA66), Nylon 6/6
  • Body Material
    Nylon 6/6
  • Bundle Center to Mounting Center
    -
  • Package Quantity
    1
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Maximum Bundle Diameter (mm)
    11.43
  • Product Depth (mm)
    25.4
  • Mounting
    Adhesive
  • Manufacturer Part Number
    04-TLS19
  • Manufacturer
    NTE Electronics
  • Schedule B
    3926909988, 3926909988/3926909988/3926909988/3926909988/3926909988
  • RoHS
    Non-Compliant
  • Package
    Bag
  • Mfr
    NTE Electronics, Inc
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bag
  • Series
    LAC
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Clip, C-Type
  • Color
    Natural
  • Style
    Twist Lock
  • Adhesive
    -
  • Screw Size
    -
  • Type Attributes
    Adjustable, Ladder
  • Opening Size
    0.866 (22.00mm)
  • Panel Hole Size
    -
  • Product Length (mm)
    25.4
  • Width
    3.543 (90.00mm)
  • Length
    1.200 (30.48mm)
  • Material Thickness

    A measure of the distance between two surfaces of an object

    -
  • Product Height (mm)
    54.58
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