04-CCL23750

NTE Electronics, Inc. 04-CCL23750

Part No:

04-CCL23750

Datasheet:

-

Package:

-

AINNX NO:

31808997-04-CCL23750

Description:

Products specifications
  • Material
    Polyamide (PA66), Nylon 6/6
  • Body Material
    Nylon
  • Bundle Center to Mounting Center
    -
  • Package Quantity
    100
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    3926.90.85.00
  • Automotive
    No
  • PPAP
    No
  • Maximum Bundle Diameter (mm)
    9.5
  • Hole Diameter (mm)
    4.6
  • Product Depth (mm)
    12
  • Mounting
    Screw Mount
  • Manufacturer Part Number
    04-CCL23750
  • Manufacturer
    NTE Electronics
  • Package
    Bag
  • Mfr
    NTE Electronics, Inc
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bag
  • Series
    TLT
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    NRND
  • Type
    Clip, Twist Lock
  • Color
    Black
  • Style
    Clamp
  • Adhesive
    -
  • Screw Size
    -
  • Type Attributes
    -
  • Opening Size
    0.580 (14.73mm)
  • Panel Hole Size
    -
  • Width
    0.520 (13.21mm)
  • Length
    1.400 (35.56mm)
  • Material Thickness

    A measure of the distance between two surfaces of an object

    -
  • Product Height (mm)
    1.5
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