Nexperia USA Inc. PMGD290UCEAX

Factory Lead Time

4 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mounting Type

Surface Mount

Package / Case

6-TSSOP, SC-88, SOT-363

Number of Pins

6

Current - Continuous Drain (Id) @ 25℃

725mA 500mA

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

80 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2014

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

280mW

Pin Count

a count of all of the component leads (or pins)

6

Number of Channels

2

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

18 ns

FET Type

N and P-Channel

Rds On (Max) @ Id, Vgs

380m Ω @ 500mA, 4.5V

Vgs(th) (Max) @ Id

1.3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

83pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

0.68nC @ 4.5V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

30ns

Fall Time (Typ)

72 ns

Continuous Drain Current (ID)

500mA

Gate to Source Voltage (Vgs)

8V

Drain to Source Breakdown Voltage

20V

FET Feature

Logic Level Gate

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant