BFM505,115

Nexperia BFM505,115

Part No:

BFM505,115

Manufacturer:

Nexperia

Datasheet:

-

Package:

-

AINNX NO:

36750377-BFM505,115

Description:

Products specifications
  • Mount
    Through Hole
  • Core Material

    Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

    Ferrite
  • RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Tolerance
    10 %
  • Termination
    Axial
  • Resistance
    430 mΩ
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    105 °C
  • Min Operating Temperature
    -55 °C
  • Shielding
    Unshielded
  • Current Rating

    Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

    508 mA
  • Military Standard
    Not
  • Inductance
    220 µH
  • Test Frequency

    a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

    1 kHz
  • DC Resistance (DCR)
    430 mΩ
  • Max DC Current
    508 mA
  • Lead/Base Style
    Axial
  • DC Current
    508 mA
  • Saturation Current
    860 mA
  • Length
    17.78 mm
  • Diameter
    6.985 mm
  • Lead Free
    Contains Lead
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