BFG10W/X,115

Nexperia BFG10W/X,115

Part No:

BFG10W/X,115

Manufacturer:

Nexperia

Datasheet:

-

Package:

-

AINNX NO:

36750375-BFG10W/X,115

Description:

Products specifications
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • RoHS
    Non-Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel
  • Termination
    Solder
  • Number of Rows
    2
  • Gender
    Male
  • Pitch
    500 µm
  • Number of Contacts
    30
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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