National Semiconductor Corporation J113

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Material

Nylon 66, UL

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Rohs Code

No

Part Life Cycle Code

Transferred

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

ROUND

Package Style

CYLINDRICAL

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

blister pack - 100 pcs

JESD-609 Code

e0

ECCN Code

EAR99

Type

Nylon cable tie

Terminal Finish

Tin/Lead (Sn/Pb)

Color

White

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Reach Compliance Code

compliant

JESD-30 Code

O-PBCY-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

DEPLETION MODE

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-92

Drain-source On Resistance-Max

100 Ω

FET Technology

JUNCTION

Power Dissipation-Max (Abs)

0.4 W

Width

3.6 mm

Length

200 mm