Multicomp MCSH21B154K500CT

Package / Case

0805

Number of Terminals

2

Manufacturer

Miscellaneous

Product Depth (mm)

1.25(mm)

Wire Form

Not Required

Operating Temp Range

-55C to 125C

Case Style

Ceramic Chip

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Surface Mount

Temp Coeff (Dielectric)

X7R

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

10%

Rad Hardened

No

Microwave Application

NO

Seated Plane Height

Not Required(mm)

MSL

-

Qualification

-

Capacitance Tolerance

± 10%

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

150000PF(pF)

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

50VDC

Product Length

2.01mm

Product Width

1.25mm

Product Length (mm)

2(mm)