Multicomp MCU0603R103KCT

Package / Case

0603

Number of Terminals

2

Product Depth (mm)

0.8(mm)

Lead Diameter (nom)

Not Required(mm)

Rad Hardened

No

Tolerance (+ or -)

10%

Temp Coeff (Dielectric)

X7R

Wire Form

Not Required

Microwave Application

YES

Seated Plane Height

Not Required(mm)

Case Style

Ceramic Chip

Operating Temp Range

-55C to 125C

Mounting Styles

Surface Mount

Product Diameter (mm)

Not Required(mm)

MSL

-

Qualification

-

Capacitance Tolerance

± 10%

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

10000PF(pF)

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

50VDC

Product Length

1.6mm

Product Width

0.85mm

Product Length (mm)

1.6(mm)

Product Height (mm)

0.8(mm)