Mitsubishi Electric CM100RL-24NF

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Material

polyolefin

Number of Terminals

20

Transistor Element Material

SILICON

Exterior Housing Material

7

Gross Weight

6.85

Transport Package Size/Quantity

103*26*25/1000

Diameter before shrinking

3 mm

Diameter after shrinking

1 mm

Wall Thickness before shrinking

0.42 mm

Part Life Cycle Code

Active

Ihs Manufacturer

MITSUBISHI ELECTRIC CORP

Part Package Code

MODULE

Package Description

FLANGE MOUNT, R-XUFM-X20

Operating Temperature-Max

150 °C

Package Body Material

UNSPECIFIED

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

supplied in lengths divisible by 1.0 m

ECCN Code

EAR99

Type

Adhesive-lined Heat Shrink Tubing

Color

transparent

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

UNSPECIFIED

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

20

JESD-30 Code

R-XUFM-X20

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

COMPLEX

Note

Possible deviation of the shrinking diameter up to +1.5 mm

Case Connection

ISOLATED

Transistor Application

POWER CONTROL

Polarity/Channel Type

N-CHANNEL

Operating Temperature Range

An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating temperature).

-55…+125 °C

Power Dissipation-Max (Abs)

620 W

Shrink Temperature

Common polyolefin materials have a recommended shrink temperature of around 9°C, although other materials offer shrink temperatures, notably Teflon, as high as 25°C.

100 °C

Collector Current-Max (IC)

100 A

Collector-Emitter Voltage-Max

1200 V

Gate-Emitter Voltage-Max

20 V

VCEsat-Max

3 V

Shrink Ratio

3 : 1

Length

1000 mm