Microsemi Corporation IRFZ48

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Package Description

PLASTIC PACKAGE-3

Drain Current-Max (ID)

50 A

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

JESD-609 Code

e0

ECCN Code

EAR99

Terminal Finish

TIN LEAD

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Polarity/Channel Type

N-CHANNEL

Drain-source On Resistance-Max

0.028 Ω

DS Breakdown Voltage-Min

60 V

FET Technology

METAL-OXIDE SEMICONDUCTOR