Microsemi W3H128M72E2-400NBI

ECCN (US)

4A994.a

Module

DRAM Module

Module Density

1Gbyte

Number of Chip per Module

5

Chip Density (bit)

1.8G

Data Bus Width (bit)

72

Max. Access Time (ns)

1.35

Maximum Clock Rate (MHz)

400

Chip Package Type

PBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

900

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

ECC Support

Yes

Number of Chip Banks

8

CAS Latency

4

SPD EEPROM Support

No

Supplier Package

BGA

Mounting

Surface Mount

Package Height

3.94(Max)

Package Length

22.1(Max)

Package Width

16.1(Max)

PCB changed

208

Pin Count

a count of all of the component leads (or pins)

208

Organization

128Mx72

PLL

No

Self Refresh

Yes

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Supplier Unconfirmed