Microsemi WEDPN16M64V-133B2M

ECCN (US)

4A994.a

Module

DRAM Module

Module Density

1Gbit

Number of Chip per Module

4

Chip Density (bit)

256M

Data Bus Width (bit)

64

Max. Access Time (ns)

6|5.5

Maximum Clock Rate (MHz)

133

Chip Configuration

16Mx16

Chip Package Type

PBGA

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

540

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

Module Sides

Single

ECC Support

No

Number of Chip Banks

4

CAS Latency

3|2

SPD EEPROM Support

No

Supplier Package

PBGA

Mounting

Surface Mount

Package Height

2.03(Max)

Package Length

21.1(Max)

Package Width

21.1(Max)

PCB changed

219

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Pin Count

a count of all of the component leads (or pins)

219

Organization

16Mx64

PLL

No

Refresh Cycles

8K

Self Refresh

Yes

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Supplier Unconfirmed