Microsemi W3E32M72S-266BM

ECCN (US)

4A994.a

Module

DRAM Module

Module Density

256Mbyte

Number of Chip per Module

5

Chip Density (bit)

460.8M

Data Bus Width (bit)

72

Max. Access Time (ns)

0.75

Maximum Clock Rate (MHz)

266

Chip Package Type

PBGA

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

2.5

Maximum Operating Supply Voltage (V)

2.7

Operating Current (mA)

2000

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

ECC Support

Yes

Number of Chip Banks

4

CAS Latency

2.5

SPD EEPROM Support

No

Supplier Package

BGA

Mounting

Surface Mount

Package Height

2.03(Max)

Package Length

32.1(Max)

Package Width

25.1(Max)

PCB changed

219

Pin Count

a count of all of the component leads (or pins)

219

Organization

32Mx72

PLL

No

Self Refresh

Yes

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Supplier Unconfirmed