Microsemi APT1001R3AN

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

2

Transistor Element Material

SILICON

Package Description

FLANGE MOUNT, O-MBFM-P2

Package Style

FLANGE MOUNT

Package Body Material

METAL

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

150 °C

Rohs Code

No

Manufacturer Part Number

APT1001R3AN

Package Shape

ROUND

Manufacturer

Microsemi Corporation

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED POWER TECHNOLOGY INC

Risk Rank

5.61

Drain Current-Max (ID)

8.5 A

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Subcategory

FET General Purpose Power

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

PIN/PEG

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

JESD-30 Code

O-MBFM-P2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-3

Drain Current-Max (Abs) (ID)

8.5 A

Drain-source On Resistance-Max

1.3 Ω

DS Breakdown Voltage-Min

1000 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

230 W

Power Dissipation Ambient-Max

230 W