Microchip Technology TN5325N8-G

Factory Lead Time

18 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-243AA

Number of Pins

4

Weight

52.786812mg

Current - Continuous Drain (Id) @ 25℃

316mA Tj

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Power Dissipation (Max)

1.6W Ta

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

25 ns

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2009

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

FAST SWITCHING

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

R-PSSO-F3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Number of Channels

1

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

1.6W

Case Connection

DRAIN

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

20 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

7 Ω @ 1A, 10V

Vgs(th) (Max) @ Id

2V @ 1mA

Input Capacitance (Ciss) (Max) @ Vds

110pF @ 25V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

15ns

Vgs (Max)

±20V

Fall Time (Typ)

15 ns

Continuous Drain Current (ID)

316mA

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

250Ohm

Drain to Source Breakdown Voltage

250V

Height

1.6mm

Length

4.6mm

Width

2.6mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant