Microchip Technology PIC12LF1840T39AT-I/ST

Factory Lead Time

24 Weeks

Package / Case

14-TSSOP (0.173, 4.40mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

14

Memory Types

FLASH

Number of I/Os

5

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

PIC®

Published

2012

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

14

Terminal Finish

Matte Tin (Sn) - annealed

Applications

General Purpose

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

800mW

Voltage - Supply

1.8V~3.6V

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Frequency

310MHz 433MHz 868MHz 915MHz

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

PIC12LF1840T39A

Interface

I2C, SPI, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

7kB

RAM Size

256kB

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Bit Size

8

Data Bus Width

8b

Data Interface

A Data Interface in EDQ is a template of a set of attributes representing a given entity, used to create processes that read from, or write to, interfaces rather than directly from or to sources or targets of data.

PCB, Surface Mount

Number of Timers/Counters

3

Core Architecture

PIC

CPU Family

PIC

Number of Programmable I/O

6

Power - Output

10dBm

Data Rate (Max)

100kbps

Current - Transmitting

16.5mA

Modulation or Protocol

Modulation is the process of converting data into radio waves by adding information to an electronic or optical carrier signal. A carrier signal is one with a steady waveform -- constant height, or amplitude, and frequency.

FSK, OOK

Antenna Connector

An antenna connector is a radio frequency connector that is located at the termination of an antenna. Its attachment to the antenna provides a conduit for the transmission of radio frequency signals with signal loss, discontinuity, and impedance mismatches kept to a strict minimum.

PCB, Surface Mount

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant