Microchip Technology PIC12LF1840T39A-I/ST

Factory Lead Time

24 Weeks

Package / Case

14-TSSOP (0.173, 4.40mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

14

Memory Types

FLASH

Number of I/Os

5

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

PIC®

Published

2012

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

14

Terminal Finish

Matte Tin (Sn) - annealed

Applications

General Purpose

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

800mW

Voltage - Supply

1.8V~3.6V

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Frequency

310MHz 433MHz 868MHz 915MHz

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

PIC12LF1840T39A

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Interface

I2C, SPI, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

7kB

RAM Size

256B

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Peripherals

PWM

Bit Size

8

Data Bus Width

8b

Data Interface

A Data Interface in EDQ is a template of a set of attributes representing a given entity, used to create processes that read from, or write to, interfaces rather than directly from or to sources or targets of data.

PCB, Surface Mount

Number of Timers/Counters

3

Core Architecture

PIC

CPU Family

PIC

Number of Programmable I/O

6

Power - Output

10dBm

Data Rate (Max)

100kbps

Number of ADC Channels

4

Current - Transmitting

16.5mA

Modulation or Protocol

Modulation is the process of converting data into radio waves by adding information to an electronic or optical carrier signal. A carrier signal is one with a steady waveform -- constant height, or amplitude, and frequency.

FSK, OOK

Number of SPI Channels

1

Antenna Connector

An antenna connector is a radio frequency connector that is located at the termination of an antenna. Its attachment to the antenna provides a conduit for the transmission of radio frequency signals with signal loss, discontinuity, and impedance mismatches kept to a strict minimum.

PCB, Surface Mount

Height

1.05mm

Length

5.1mm

Width

4.5mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free