Microchip Technology AT25SF041-SHD-B

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Cell Type

NOR

Chip Density (bit)

4M

Block Organization

Symmetrical

Location of Boot Block

Bottom|Top

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

512K

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

8

Maximum Erase Time (S)

10/Chip

Maximum Programming Time (ms)

2.5/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Maximum Operating Frequency (MHz)

85

Minimum Operating Supply Voltage (V)

2.5

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.5 to 3.6

Operating Current (mA)

12

Program Current (mA)

16

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

1.91(Max)

Package Width

5.4(Max)

Package Length

5.35(Max)

PCB changed

8

Standard Package Name

SOP

Supplier Package

SOIC EIAJ

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

8

Architecture

Sectored

Sector Size

4Kbyte x 128

Page Size

256byte

Boot Block

Yes