Microchip Technology AT25DF081-SSHN-T

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Cell Type

NOR

Chip Density (bit)

8M

Block Organization

Symmetrical

Address Bus Width (bit)

20

Number of Bits/Word (bit)

8

Number of Words

1M

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

7

Maximum Erase Time (S)

14/Chip

Maximum Programming Time (ms)

5/Page

Interface Type

Serial-SPI

Minimum Operating Supply Voltage (V)

1.65

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Programming Voltage (V)

1.65 to 1.95

Operating Current (mA)

12

Program Current (mA)

15

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000(Typ)

Mounting

Surface Mount

Package Height

1.5(Max)

Package Width

3.99(Max)

Package Length

5.05(Max)

PCB changed

8

Standard Package Name

SOP

Supplier Package

SOIC

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

8

Architecture

Sectored

Sector Size

4Kbyte x 256

Page Size

256byte

Boot Block

No