Microchip DSPIC33EP64GS708T-E/PT

Factory Lead Time

14 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

80

Risk Rank

5.48

Clock Frequency-Max

60 MHz

Number of I/O Lines

67

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFQFP

Package Shape

SQUARE

Package Style

FLATPACK, THIN PROFILE, FINE PITCH

RAM(byte)

8192

ROM(word)

65536

Supply Voltage-Max

3.6 V

Supply Voltage-Nom

3.3 V

Manufacturer Part Number

DSPIC33EP64GS708T-E/PT

Part Life Cycle Code

Active

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Package Description

TFQFP,

Supply Voltage-Min

3 V

Usage Level

Automotive grade

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ADC SAMPLE AND HOLD (5-CH 12-BIT)

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PQFP-G80

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Bit Size

16

Has ADC

YES

DMA Channels

NO

PWM Channels

YES

DAC Channels

YES

Seated Height-Max

1.2 mm

On Chip Program ROM Width

8

Screening Level

AEC-Q100; TS 16949

ROM Programmability

FLASH

Length

12 mm

Width

12 mm