Microchip ATSAMD21E17D-MZ

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

32

Supply Voltage-Max

3.63 V

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Shape

SQUARE

Package Code

HVQCCN

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Number of I/O Lines

26

Clock Frequency-Max

32 MHz

Risk Rank

5.08

Package Description

HVQCCN,

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Part Life Cycle Code

Active

Rohs Code

Yes

Manufacturer Part Number

ATSAMD21E17D-MZ

Supply Voltage-Min

1.62 V

Usage Level

Automotive grade

JESD-609 Code

e3

Terminal Finish

Matte Tin (Sn)

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

compliant

JESD-30 Code

S-XQCC-N32

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

Speed

48 MHz

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Bit Size

32

Has ADC

YES

DMA Channels

YES

PWM Channels

YES

DAC Channels

YES

Seated Height-Max

0.9 mm

On Chip Program ROM Width

8

Screening Level

AEC-Q100; TS 16949

ROM Programmability

FLASH

Width

5 mm

Length

5 mm