APTM120A29FTG

Microchip APTM120A29FTG

Part No:

APTM120A29FTG

Manufacturer:

Microchip

Datasheet:

-

Package:

SP4

AINNX NO:

34275164-APTM120A29FTG

Description:

Trans MOSFET Array Dual N-CH 1.2KV 34A 20-Pin Case SP4

Products specifications
  • Mounting Type
    Chassis Mount
  • Package / Case
    SP4
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Supplier Device Package
    SP4
  • Number of Terminals
    12
  • Transistor Element Material
    SILICON
  • Continuous Drain Current Id
    34
  • Package
    Bulk
  • Base Product Number
    APTM120
  • Current - Continuous Drain (Id) @ 25℃
    34A
  • Mfr
    Microchip Technology
  • Product Status
    Active
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Manufacturer
    Microchip
  • Brand
    Microchip Technology
  • RoHS
    Details
  • Package Description
    FLANGE MOUNT, R-XUFM-X12
  • Package Style
    FLANGE MOUNT
  • Moisture Sensitivity Levels
    1
  • Package Body Material
    UNSPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Operating Temperature-Max
    150 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    APTM120A29FTG
  • Package Shape
    RECTANGULAR
  • Number of Elements
    2
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    MICROSEMI CORP
  • Risk Rank
    5.25
  • Drain Current-Max (ID)
    34 A
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 150°C (TJ)
  • Series
    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • JESD-609 Code
    e1
  • Pbfree Code
    Yes
  • ECCN Code
    EAR99
  • Terminal Finish
    TIN SILVER COPPER
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    AVALANCHE RATED
  • Subcategory
    Discrete Semiconductor Modules
  • Technology
    MOSFET (Metal Oxide)
  • Terminal Position
    UPPER
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    UNSPECIFIED
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reach Compliance Code
    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    12
  • JESD-30 Code
    R-XUFM-X12
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Configuration
    2 N-Channel (Half Bridge)
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Case Connection
    ISOLATED
  • Power - Max
    780W
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    348mOhm @ 17A, 10V
  • Vgs(th) (Max) @ Id
    5V @ 5mA
  • Input Capacitance (Ciss) (Max) @ Vds
    10300pF @ 25V
  • Gate Charge (Qg) (Max) @ Vgs
    374nC @ 10V
  • Drain to Source Voltage (Vdss)
    1200V (1.2kV)
  • Polarity/Channel Type
    N-CHANNEL
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Discrete Semiconductor Modules
  • Drain-source On Resistance-Max
    0.348 Ω
  • Pulsed Drain Current-Max (IDM)
    136 A
  • DS Breakdown Voltage-Min
    1200 V
  • Channel Type
    Dual N
  • Avalanche Energy Rating (Eas)
    3000 mJ
  • FET Technology
    METAL-OXIDE SEMICONDUCTOR
  • FET Feature
    -
  • Product Category

    a particular group of related products.

    Discrete Semiconductor Modules
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