Malico Inc. UNI-H19052-23P/2.6BU

Material

Aluminum Alloy

Shape

Square, Fins

Package Cooled

BGA

Material Finish

Black Anodized

Mfr

Malico Inc.

Fin Height

0.787" (20.00mm)

Series

Uni-Holder Elliptical Fin

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Attachment Method

Clip

Thermal Resistance @ Forced Air Flow

5.36°C/W @ 200 LFM

Thermal Resistance @ Natural

10.55°C/W

Length

0.748" (19.00mm)

Width

0.748" (19.00mm)