HBA25031-10/CU/Y

Malico Inc. HBA25031-10/CU/Y

Part No:

HBA25031-10/CU/Y

Manufacturer:

Malico Inc.

Datasheet:

-

Package:

-

AINNX NO:

69650575-HBA25031-10/CU/Y

Description:

CU HEAT SINK 25X25X10MM WITH LIN

Products specifications
  • Material
    Copper
  • Shape
    Square, Fins
  • Package Cooled
    BGA
  • Mfr
    Malico Inc.
  • Fin Height
    0.307" (7.80mm)
  • Series
    HBA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Top Mount
  • Attachment Method
    Clip
  • Length
    0.984" (25.00mm)
  • Width
    0.984" (25.00mm)
0 Similar Products Remaining