KEMET TOKIN TEPSGB20E337M9-8R

Package / Case

3528-19

Operating Temperature Max Deg. C

105C

Product Depth (mm)

2.8(mm)

DF

8%

Operating Temp Range

-55C to 105C

Case Style

Molded

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Surface Mount

Length W/Weld

Not Required(mm)

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

20%

DCL

82.5(uA)

Operating Temperature Min Deg. C

-55C

Seal

Not Required

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

330UF(pF)

Construction

SMT Chip

Termination Style

Not Required

Polarity

Polar

Voltage

2.5VDC

Insulation

Not Required

ESR

0.09(ohm)

Product Length (mm)

3.5(mm)

Product Height (mm)

1.9(mm)