KEMET TOKIN TEFPSA30J107M(100)8R

Package / Case

3216-09

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Surface Mount

Length W/Weld

Not Required(mm)

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

20%

DCL

63(uA)

Operating Temperature Min Deg. C

-55C

Seal

Not Required

Case Style

Molded

Operating Temp Range

-55C to 105C

DF

8%

Product Depth (mm)

1.6(mm)

Operating Temperature Max Deg. C

105C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

100UF(pF)

Construction

SMT Chip

Termination Style

Not Required

Polarity

Polar

Voltage

6.3VDC

Insulation

Not Required

ESR

0.1(ohm)

Product Length (mm)

3.2(mm)

Product Height (mm)

0.9(mm)