Mounting Type
Brass Contact Pin
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO
Number of Terminals
3
Manufacturer
PINREX
RoHS
Y
Manufacturer Part Number
CS142-12IO8
Package Shape
ROUND
Number of Elements
1
Part Life Cycle Code
Active
Ihs Manufacturer
LITTELFUSE INC
Risk Rank
5.19
Rohs Code
Yes
Operating Temperature-Max
125 °C
Reflow Temperature-Max (s)
NOT SPECIFIED
Operating Temperature-Min
-40 °C
Package Body Material
METAL
Leakage Current-Max
15 mA
Package Style
POST/STUD MOUNT
Package Description
POST/STUD MOUNT, O-MUPM-H3
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Insulation Resistance - 1000mOhm Min.
Tolerance
Contact Resistance - 20mOhm Max.
Subcategory
Silicon Controlled Rectifiers
Terminal Position
UPPER
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
HIGH CURRENT CABLE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
compliant
JESD-30 Code
O-MUPM-H3
Qualification Status
An indicator of formal certification of qualifications.
Not Qualified
Configuration
SINGLE
Voltage
2 Amp
Case Connection
ANODE
JEDEC-95 Code
TO-209AC
Trigger Device Type
SCR
Repetitive Peak Off-state Voltage
1200 V
Non-Repetitive Pk On-state Cur
3100 A
Critical Rate of Rise of Off-State Voltage-Min
1000 V/us
Repetitive Peak Reverse Voltage
1200 V
RMS On-state Current-Max
260 A
Holding Current-Max
200 mA
DC Gate Trigger Current-Max
150 mA
DC Gate Trigger Voltage-Max
2.5 V
Circuit Commutated Turn-off Time-Nom
150 µs