IXYS CS72-16IO8

Mounting Type

Term: ¼in Solder Lug Quick-Connect, w/Stud Can

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Manufacturer

BARKER MICROFARADS INC

RoHS

Y

Manufacturer Part Number

CS72-16IO8

Package Description

POST/STUD MOUNT, O-MUPM-H3

Package Style

POST/STUD MOUNT

Leakage Current-Max

15 mA

Package Body Material

METAL

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

125 °C

Rohs Code

Yes

Package Shape

ROUND

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

LITTELFUSE INC

Risk Rank

5.19

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

2.156in x 1.312in Oval Case

Tolerance

±6%

Capacitance

156uF

Subcategory

Silicon Controlled Rectifiers

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

HIGH CURRENT CABLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

JESD-30 Code

O-MUPM-H3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Voltage

440VAC

Case Connection

ANODE

JEDEC-95 Code

TO-209AC

Trigger Device Type

SCR

Repetitive Peak Off-state Voltage

1600 V

Non-Repetitive Pk On-state Cur

2000 A

Critical Rate of Rise of Off-State Voltage-Min

1000 V/us

Repetitive Peak Reverse Voltage

1600 V

RMS On-state Current-Max

160 A

Holding Current-Max

200 mA

DC Gate Trigger Current-Max

150 mA

DC Gate Trigger Voltage-Max

3 V

Circuit Commutated Turn-off Time-Nom

150 µs