Isocom Components ICPL0600SMT&A;R

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.49.80.00

Automotive

No

PPAP

No

Logic Gate Type

NAND

Direction Type

Uni-Directional

Minimum Isolation Voltage (Vrms)

3750

Maximum Rise Time (us)

0.04

Typical Rise Time (us)

0.03

Maximum Fall Time (us)

0.02

Typical Fall Time (us)

0.01

Maximum Forward Current (mA)

20

Maximum Continuous Output Current (mA)

50

Typical Forward Voltage (V)

1.4

Maximum Forward Voltage (V)

1.8

Maximum Reverse Voltage (V)

5(Min)

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

100

Mounting

Surface Mount

Package Height

3.18

Package Width

3.92

Package Length

4.88

PCB changed

8

Standard Package Name

DIP

Supplier Package

PDIP SMD

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

8

Polarity

Inverting

Input Type

DC