Isocom Components H11L2SMT&A;R

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.49.80.00

Automotive

No

PPAP

No

Logic Gate Type

NAND Schmitt

Number of Channels per Chip

1

Direction Type

Uni-Directional

Minimum Isolation Voltage (Vrms)

5300

Typical Rise Time (us)

0.1

Typical Fall Time (us)

0.05

Maximum Propagation Delay Time (ns)

6000

Maximum Forward Current (mA)

50

Maximum Continuous Output Current (mA)

50

Maximum Forward Voltage (V)

1.5

Maximum Reverse Voltage (V)

6

Maximum Power Dissipation (mW)

170

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Mounting

Surface Mount

Package Height

3.5

Package Width

6.5

Package Length

7.12

PCB changed

6

Standard Package Name

DIP

Supplier Package

PDIP SMD

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

6

Output Type

Open Collector

Polarity

Inverting

Standard

UL