Inphi WPIXF1104BE.B1-993991

Ethernet Interface Type

GMII|RGMII

Communication Mode

Full Duplex|Half Duplex

Standard Supported

IEEE 802.3|IEEE 802.3x

Physical Network Type

1000BASE-T|1000BASE-X

Category

Single Chip

PPAP

No

Automotive

No

HTS

8542.31.00.01

ECCN (US)

5A991.b.4.a

EU RoHS

Compliant

Minimum Operating Supply Voltage (V)

1.65|2.3|3

Typical Operating Supply Voltage (V)

1.8|2.5|3.3

Maximum Operating Supply Voltage (V)

1.95|2.7|3.6

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Loopback Mode

Internal

DMA Support

No

Auto-Negotiation

Yes

Mounting

Surface Mount

Package Height

3.34(Max)

Package Width

25

Package Length

25

PCB changed

552

Standard Package Name

BGA

Supplier Package

FCBGA

Lead Shape

Ball

Package Description

,

Rohs Code

Yes

Manufacturer Part Number

WPIXF1104BE.B1-993991

Manufacturer

Cortina Systems Inc

Part Life Cycle Code

Transferred

Ihs Manufacturer

CORTINA SYSTEMS INC

Risk Rank

5.63

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

552