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GCIXF18201EC.B1-886340

Inphi GCIXF18201EC.B1-886340

Part No:

GCIXF18201EC.B1-886340

Manufacturer:

Datasheet:

Package:

-

AINNX NO:

31952220-GCIXF18201EC.B1-886340

Category:

PMIC - Power Over Ethernet (PoE) Controllers

Description:

Products specifications

EU RoHS
Not Compliant
ECCN (US)
5A991
Automotive
No
PPAP
No
Category
Single Chip
Standard Supported
IEEE 802.3x
Host Interface
SPI4-2
DMA Support
No
Auto-Negotiation
No
Mounting
Surface Mount
PCB changed
672
Standard Package Name
BGA
Supplier Package
BGA
Lead Shape
Ball
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete
Pin Count
a count of all of the component leads (or pins)
672

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