Infineon Technologies AG IRF7301TR

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Weight

0.2 kg

Number of Terminals

8

Transistor Element Material

SILICON

Exterior Housing Material

2

Gross Weight

215.00

Equivalent

POS40

Soldering Temperature

285...330 °C

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INFINEON TECHNOLOGIES AG

Drain Current-Max (ID)

4.3 A

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

coil

JESD-609 Code

e3

ECCN Code

EAR99

Type

Soft Tin-Lead Solder Sn/Pb

Terminal Finish

MATTE TIN

Composition

tin - 40%; lead - 60%

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOGIC LEVEL COMPATIBLE

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G8

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

MS-012AA

Drain-source On Resistance-Max

0.05 Ω

Design

wire

DS Breakdown Voltage-Min

20 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Saturation Current

2

Diameter

2 mm