Infineon Technologies AG IRF6714MPBF

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INFINEON TECHNOLOGIES AG

Package Description

CHIP CARRIER, R-XBCC-N3

Drain Current-Max (ID)

29 A

Number of Elements

1

Operating Temperature-Max

150 °C

Package Body Material

UNSPECIFIED

Package Shape

RECTANGULAR

Package Style

CHIP CARRIER

ECCN Code

EAR99

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

R-XBCC-N3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

Drain-source On Resistance-Max

0.0021 Ω

Pulsed Drain Current-Max (IDM)

234 A

DS Breakdown Voltage-Min

25 V

Avalanche Energy Rating (Eas)

175 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

89 W